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Preliminary
RT9004
300mA, Low Noise, Ultra-Fast CMOS Triple LDOs Regulator
General Description
The RT9004 is designed for portable RF and wireless applications with demanding performance and space requirements. The RT9004 performance is optimized for battery-powered systems to deliver ultra low noise and low quiescent current. Regulator ground current increases only slightly in dropout, further prolonging the battery life. The RT9004 also works with low-ESR ceramic capacitors, reducing the amount of board space necessary for power applications, critical in hand-held wireless devices. The RT9004 consumes less than 0.01uA in shutdown mode and has fast turn-on time less than 50us. RT9004 is short circuit thermal folded back protected. RT9004 lowers its OTP trip point from 165C to 110C when output short circuit occurs (VOUT < 0.4V) providing maximum safety to end users. The other features include ultra low dropout voltage, high output accuracy, current limiting protection, and high ripple rejection ratio. Available in the VDFN-10L 3x3 and WDFN-10L 3x3 packages, the RT9004 also offers custom voltage, range of 1.5V to 3.5V with 0.1V per step.
Features
Short Circuit Thermal Folded Back Protection Low-Noise for RF Application Fast Response in Line/Load Transient Quick Start-Up (Typically 50us) Low Dropout : 220mV @ 300mA Wide Operating Voltage Ranges : 2.5V to 5.5V TTL-Logic-Controlled Shutdown Input Low Temperature Coefficient Thermal Shutdown Protection Only 1uF Output Capacitor Required for Stability High Power Supply Rejection Ratio Custom Voltage Available Small 10-Lead VDFN and WDFN Packages RoHS Compliant and 100% Lead (Pb)-Free
Applications
CDMA/GSM Cellular Handsets Battery-Powered Equipment Laptop, Palmtops, Notebook Computers Hand-Held Instruments PCMCIA Cards Portable Information Appliances
Ordering Information
RT9004 Package Type QV : VDFN-10L 3x3 (V-Type) QW : WDFN-10L 3x3 (W-Type) Operating Temperature Range P : Pb Free with Commercial Standard G : Green (Halogen Free with Commercial Standard) Voltage Version : VOUT1/VOUT2/VOUT3 A : 2.8V/2.5V/1.8V B : 3.0V/2.5V/1.8V C : 2.8V/2.8V/1.8V D : 2.8V/1.8V/1.8V E : 3.3V/2.8V/1.8V F : 3.3V/2.8V/2.8V G : 2.5V/2.8V/2.5V H : 2.8V/2.8V/1.5V J : 1.5V/3.3V/3.3V K : 3.0V/3.0V/1.8V
Pin Configurations
(TOP VIEW)
VOUT1 VOUT2 GND VOUT3 EN3
1 2 3 4 5 11 10 9
GND
VIN1 EN1 8 VIN2 7 EN2 VIN3
V/WDFN-10L 3x3
Marking Information
For marking information, contact our sales representative directly or through a Richtek distributor located in your area, otherwise visit our website for detail.
Note :
Richtek Pb-free and Green products are : RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020. Suitable for use in SnPb or Pb-free soldering processes. 100% matte tin (Sn) plating. DS9004-00 February 2008
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RT9004
Typical Application Circuit
VIN CIN 2.2uF Chip Enable Chip Shutdown
Preliminary
RT9004 VIN1 VOUT1 VIN2 VIN3 EN1 EN2 EN3 VOUT2 VOUT3 COUT 1uF
VOUT1 VOUT2 VOUT3
GND
VIN1 VIN2 VIN3 Chip Enable Chip Shutdown CIN 1uF
RT9004 VIN1 VOUT1 VIN2 VIN3 VOUT2 VOUT3 COUT 1uF
VOUT1 VOUT2 VOUT3
EN1 EN2 EN3
GND
Functional Pin Description
Pin Number 1 2 3 Exposed Pad (11) 4 5 6 7 8 9 10 Pin Nam e VOUT1 VOUT2 GND VOUT3 EN3 VIN3 EN2 VIN2 EN1 VIN1 Output Voltage 1. Output Voltage 2. Ground. The exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. Output Voltage 3. Chip Enable 3 (Active High). Note that this pin is high impedance. There should be a pull low 100k resistor connected to GND when the control signal is floating. Input Voltage 3. Chip Enable 2 (Active High). Note that this pin is high impedance. There should be a pull low 100k resistor connected to GND when the control signal is floating. Input Voltage 2. Chip Enable 1 (Active High). Note that this pin is high impedance. There should be a pull low 100k resistor connected to GND when the control signal is floating. Input Voltage 1. Pin Function
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Preliminary Function Block Diagram
EN1 Shutdown and Logic Control VREF +
Error Amplifier
RT9004
VIN1
MOS Driver VOUT1 Current-Limit and Thermal Protection GND
EN2
Shutdown and Logic Control VREF +
Error Amplifier
VIN2
MOS Driver VOUT2 Current-Limit and Thermal Protection
EN3
Shutdown and Logic Control VREF +
Error Amplifier
VIN3
MOS Driver VOUT3 Current-Limit and Thermal Protection
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RT9004
Absolute Maximum Ratings
Preliminary
(Note 1) 6.0V 0.952 W 105C/W 150C 260C -65C to 125C 2kV 200V
Supply Input Voltage -----------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25C V/WDFN-10L 3x3 ---------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 4) V/WDFN-10L 3x3, JA ---------------------------------------------------------------------------------------------------Junction Temperature ----------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10sec.) -------------------------------------------------------------------------------Storage Temperature Range -------------------------------------------------------------------------------------------ESD Susceptibility (Note 2) HBM (Human Body Mode) ---------------------------------------------------------------------------------------------MM (Machine Mode) ------------------------------------------------------------------------------------------------------
Recommended Operating Conditions
(Note 3)
Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.5V to 5.5V Operation Ambient Temperature Range ------------------------------------------------------------------------------ -40C to 85C Operation Junction Temperature Range ------------------------------------------------------------------------------ -40C to 125C
Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1F, TA = 25C, unless otherwise specified)
Parameter Output Voltage Accuracy Current Limit Quiescent Current Dropout Voltage (Note 4) Line Regulation Load Regulation Standby Current EN Input Bias Current EN Threshold Power Supply Rejection Rate Logic-Low Voltage
Symbol VOUT ILIM IQ VDROP VLINE
Test Conditions IOUT = 1mA RLOAD = 1 VEN >= 1.2V, IOUT = 0mA IOUT = 200mA IOUT = 300mA VIN = (VOUT + 1V) to 5.5V, IOUT = 1mA
Min -2 360 --------1.2 ------
Typ -400 90 170 220 --0.01 0 ---60 -30 165 30 110
Max +2 ----0.3 0.6 1 100 0.4 -------
Units % mA A mV % % A nA V
VLOAD 1mA < IOUT < 300mA ISTBY IIBSD VIL VEN = GND, Shutdown VEN = GND or VIN VIN = 3V to 5.5V, Shutdown VIN = 3V to 5.5V, Start-Up COUT = 1F, IOUT = 100mA
Logic-High Voltage VIH f = 100Hz f = 10kHz PSRR TSD TSD TTFB
dB C C C
Thermal Shutdown Temperature Thermal Shutdown Hysteresis Thermal Folded Back Temperature
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Preliminary
RT9004
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive. Handling precaution is recommended. Note 3. The device is not guaranteed to function outside its operating conditions. Note 4. JA is measured in the natural convection at TA = 25C on a low effective thermal conductivity test board (single-later, 1s) of JEDEC 51-3 thermal measurement standard.
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RT9004
Preliminary
Typical Operating Characteristics
Output Voltage vs. Temperature
2
Quiesent Current vs. Temperature
100 95
VIN = 5V CIN = COUT = 1uF
VIN = 3.3V VOUT = 1.5V CIN = COUT = 1uF
Quiescent Current (uA)
Output Voltage (V)
1.9
90 85 80 75 70 65
1.8
No Load
1.7
1.6 -50 -25 0 25 50 75 100 125
60 -50 -25 0 25 50 75 100 125
Temperature (C)
Temperature (C)
EN Pin Shutdown Threshold vs. Temperature
1.5
Current Limit vs. Input Voltage
600 550
EN Pin Threshold Voltage (V)
1.25
VIN = 3.3V VOUT = 1.5V CIN = COUT = 1uF
VOUT = 1.5V CIN = COUT = 1uF
Current Limit (mA)
500 450 400 350 300
1
0.75
0.5
0.25 -50 -25 0 25 50 75 100 125
2
2.5
3
3.5
4
4.5
5
5.5
6
6.5
Temperature (C)
Input Voltage (V)
Dropout Voltage vs. Load Current
300 250 200 150
VOUT = 3.3V CIN = COUT = 1uF
20
PSRR
VOUT = 2.5V CIN = COUT = 1uF, X7R
TJ = 125C
0
Dropout Voltage (mV)
PSRR (dB)
TJ = 25C
-20
TJ = -40C
100 50 0 0 0.05 0.1 0.15 0.2 0.25 0.3
-40
ILOAD = 100mA
-60
ILOAD = 10mA
-80
10 0.01
100 0.1
1K 1
10K 10
100K 100
1M 1000
Load Current (A)
Frequency (kHz) (Hz)
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Preliminary
RT9004
Line Transient Response
Line Transient Response
Input Voltage Deviation (V)
5 4 3
Input Voltage Deviation (V)
CIN = COUT = 1uF
ILOAD = 50mA
CIN = COUT = 1uF 5 4 3
ILOAD = 250mA
Output Voltage Deviation (mV)
20 0 -20
Output Voltage Deviation (mV)
50 0 -50
Time (100s/Div)
Time (100s/Div)
Load Transient Response
Load Current (mA)
100 50 0
Load Transient Response
Load Current (mA)
400 200 0 VIN = 3.3V CIN = COUT = 1uF VOUT = 1.5V ILOAD = 1mA to 250mA
VIN = 3.3V CIN = COUT = 1uF
VOUT = 1.5V ILOAD= 1mA to 50mA
Output Voltage Deviation (mV)
50 0 -50
Output Voltage Deviation (mV)
50 0 -50
Time (100s/Div)
Time (100s/Div)
Start Up
VIN = 3.3V, CIN = 2.2F
Start Up
VIN = 3.3V, CIN = 2.2F
EN (2V/Div) VOUT1 (2V/Div) VOUT2 (2V/Div) VOUT3 (200mV/Div) Time (10s/Div)
EN (2V/Div) VOUT1 (2V/Div) VOUT2 (2V/Div) VOUT3 (2V/Div) Time (25s/Div)
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RT9004
Noise
VOUT = 2.8V, ILOAD = 150mA 600 400
Preliminary
Noise
VOUT = 2.5V, ILOAD = 150mA 600 400
Noise (uV/Div)
200 0 -200 -400 -600
Noise (uV/Div)
200 0 -200 -400 -600
Time (1ms/Div)
Time (1ms/Div)
Noise
VOUT = 1.8V, ILOAD = 150mA 600 400
Noise (uV/Div)
200 0 -200 -400 -600
Time (1ms/Div)
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Preliminary Applications Information
Like any low-dropout regulator, the external capacitors used with the RT9004 must be carefully selected for regulator stability and performance. Using a capacitor whose value is > 2.2F on the RT9004 input and the amount of capacitance can be increased without limit. The input capacitor must be located a distance of not more than 0.5 inch from the input pin of the IC and returned to a clean analog ground. Any good quality ceramic or tantalum can be used for this capacitor. The capacitor with larger value and lower ESR (equivalent series resistance) provides better PSRR and line-transient response. The output capacitor must meet both requirements for minimum amount of capacitance and ESR in all LDOs application. The RT9004 is designed specifically to work with low ESR ceramic output capacitor in space-saving and performance consideration. Using a ceramic capacitor whose value is at least 1F with ESR is > 20m on the RT9004 output ensures stability. The RT9004 still works well with output capacitor of other types due to the wide stable ESR range. Figure 1 shows the curves of allowable ESR range as a function of load current for various output capacitor values. Output capacitor of larger capacitance can reduce noise and improve load transient response, stability, and PSRR. The output capacitor should be located not more than 0.5 inch from the VOUT pin of the RT9004 and returned to a clean analog ground. Enable Function
RT9004
The RT9004 features an LDO regulator enable/disable function. To assure the LDO regulator will switch on, the EN turn on control level must be greater than 1.2 volts. The LDO regulator will go into the shutdown mode when the voltage on the EN pin falls below 0.4 volts. For to protecting the system, the RT9004 have a quick-discharge function. If the enable function is not needed in a specific application, it may be tied to VIN to keep the LDO regulator in a continuously on state. Thermal Considerations Thermal protection limits power dissipation in RT9004. When the operation junction temperature exceeds 165C, the OTP circuit starts the thermal shutdown function and turns the pass element off. The pass element turn on again after the junction temperature cools by 30C. RT9004 lowers its OTP trip level from 165C to 110C when output short circuit occurs (VOUT < 0.4V) as shown in Figure 2. This limits IC case temperature under 100C and provides maximum safety to end users when output short circuit occurs.
VOUT Short to GND
0.4V VOUT
Region of Stable COUT ESR vs. Load Current
100.00 100
IOUT
10 10.00
Instable
TSD
C OUT ESR ()
1.00 1
COUT = 1uF
165 C 110 C OTP Trip Point 110 C IC Temperature 80 C
0.10
Stable
0.01
COUT = 1F, X7R
0.00 0 50 100
Instable
150 200 250 300
Load Current (mA)
Figure 2. Short Circuit Thermal Folded Back Protection when Output Short Circuit Occurs
Figure 1
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RT9004
Preliminary
1500
Maximum Power Dissipation (mW) (m)
For continuous operation, do not exceed absolute maximum operation junction temperature 125C. The power dissipation definition in device is : PD = (VIN-VOUT) x IOUT + VIN x IQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = ( TJ(MAX) - TA ) /JA Where T J(MAX) is the maximum operation junction temperature 125C, TA is the ambient temperature and the JA is the junction to ambient thermal resistance. For recommended operating conditions specification of RT9004, where T J(MAX) is the maximum junction temperature of the die (125C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance JA is layout dependent. For VDFN-10L 3x3 and WDFN-10L 3x3 packages, the thermal resistance JA is 105C/W on the standard JEDEC 51-3 single-layer 1s thermal test board and 70C/W on the standard JEDEC 51-7 4-layers 2S2P thermal test board. The maximum power dissipation at TA = 25C can be calculated by following formula : PD(MAX) = ( 125C - 25C ) / 105 = 0.952 W for single-layer 1s board PD(MAX) = ( 125C - 25C ) / 70 = 1.428 W for 4-layers 2S2P board The maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance JA. For RT9004 packages, the Figure 3 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed.
1350 1200 1050 900 750 600 450 300 150 0 0 25 50 75 100 125
4-Layers Board
Single-Layer Board
Ambient Temperature (C)
Figure 3. Derating Curves for RT9004 Package
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Preliminary Outline Dimension
D2
RT9004
D
L
E
E2 SEE DETAIL A
2 1 2 1
1
e A A1 A3
b
DETAIL A Pin #1 ID and Tie Bar Mark Options Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated.
Symbol A A1 A3 b D D2 E E2 e L
Dimensions In Millimeters Min 0.800 0.000 0.175 0.180 2.950 2.300 2.950 1.500 0.500 0.350 0.450 Max 1.000 0.050 0.250 0.300 3.050 2.650 3.050 1.750
Dimensions In Inches Min 0.031 0.000 0.007 0.007 0.116 0.091 0.116 0.059 0.020 0.014 0.018 Max 0.039 0.002 0.010 0.012 0.120 0.104 0.120 0.069
V-Type 10L DFN 3x3 Package
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RT9004
Preliminary
D
D2
L
E
E2 SEE DETAIL A
2 1 2 1
1
e A A1 A3
b
DETAIL A Pin #1 ID and Tie Bar Mark Options Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated.
Symbol A A1 A3 b D D2 E E2 e L
Dimensions In Millimeters Min 0.700 0.000 0.175 0.180 2.950 2.300 2.950 1.500 0.500 0.350 0.450 Max 0.800 0.050 0.250 0.300 3.050 2.650 3.050 1.750
Dimensions In Inches Min 0.028 0.000 0.007 0.007 0.116 0.091 0.116 0.059 0.020 0.014 0.018 Max 0.031 0.002 0.010 0.012 0.120 0.104 0.120 0.069
W-Type 10L DFN 3x3 Package
Richtek Technology Corporation
Headquarter 5F, No. 20, Taiyuen Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)5526789 Fax: (8863)5526611
Richtek Technology Corporation
Taipei Office (Marketing) 8F, No. 137, Lane 235, Paochiao Road, Hsintien City Taipei County, Taiwan, R.O.C. Tel: (8862)89191466 Fax: (8862)89191465 Email: marketing@richtek.com
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